Designed and manufactured to cope with harsh environments.
We excel in the manufacture of prototypes, through to high volume, high complexity surface mount, lead through hole and mixed technology assemblies and modules on a wide variety of board substrates.
Using the latest cutting-edge manufacturing methodologies allows us to offer our customers a world-class capability including digital, analogue, microwave and RF products, vapour phase, selective soldering, encapsulation, convection reflow, exotic board substrates and conformal coating.
From product concept to production, our expertise allows us to take a flexible and agile approach and our customers benefit from the added value we offer through design for manufacture and design for test, with a significantly positive impact on acquisition and through-life costs, and lead times.
Download our 2025 electronic manufacturing brochure