Our facility features state-of-the-art proven automated processes, producing advanced, complex printed electronic circuit assemblies designed and manufactured to cope with harsh environments in a broad range of applications across multiple sectors and industries.
Our expert team takes a flexible and agile approach to respond quickly, efficiently and cost-effectively to your individual needs, providing high levels of quality and customer service.
We excel in the manufacture of prototype through to high volume, high complexity surface mount, lead through hole and mixed technology assemblies and modules on a wide variety of board substrates.
Our cutting edge manufacturing methodologies in the production of printed electronic circuit assemblies and modules means we offer a world class manufacturing capability including digital, analogue, microwave and RF products, vapour phase, selective soldering, encapsulation, convection reflow, exotic board substrates, conformal coating.
We offer automatic placement component verification, wash facilities, optical inspection and x-ray inspection as well as repairs and upgrades.
Our integrated test capability means we can design and support test solutions from concept to the end of product life cycle, including the design and manufacture of special to type ATE’s, software programming and fixture interfacing for digital/analogue midata and PXI ATE’s, boundary scan technology, MDA (Takaya Roving Probe) programming and interfaces, wiring harness and backplane testing, ESS vibration, thermal cycling and thermal shock, and reliability and qualification testing.
We add value through design for manufacture and design for test. From product concept, we provide DfM/DfT advice to our customers on realisation, manufacturability, testability, yield improvement and risk reduction.
Many of our customers have found that this has had a significantly positive effect on acquisition cost, through life cost and lead time.
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