Rad hard system-on-chip design for harsh environments
When Application Specific Integrated Circuits (ASICs) combine a rich set of functions, typically aggregating intellectual property from several sources on one integrated circuit chip, it is known as a “System-on-Chip” (SoC) design. As a world leader in developing, manufacturing, and deploying state-of-the-art, rad-hard ASIC technology for use in defense, intelligence, research, and commercial space missions, BAE Systems is ready to provide SoCs for missions that take place in the harsh environment of space.
Our rad-hard SoC ASICs are specifically designed to perform reliably in harsh environments where a chip’s physical structure or functionality can be impaired by exposure to radiation – like satellites in earth’s orbit or spacecraft exploring distant planets. BAE Systems’ radiation-hardened ASIC technologies not only resist radiation induced upsets or damage, but are compatible with a wide variety of commercially available design tools and feature lower power and higher-reliability enhancements. We also have an expanding set of synthesizable, reusable cores to reduce cost, increase design productivity, and lower risk.
Bringing all the advantages of RH12™ technology to the table
BAE Systems is creating the RH12 ASIC storefront. This technology provides users with greatly improved Size, Weight and Power (SWaP) attributes. The ASIC development library contains an expanding selection of intellectual property (IP) developed by BAE Systems and other popular third-party IP providers. This includes parties that are currently using our radiation hardened by design (RHBD) services. IP elements will be added to the library as they are qualified via test vehicles. BAE Systems is now working with early adopter customers to develop 12nm ASICs in parallel with the RH12 library evolution.
Expert application specific integrated circuit (ASIC) design services
BAE Systems gives our customers a competitive edge where it counts - whether they are in the defense, intelligence, or commercial sector - and our ASICs design services exemplify that for those who prefer to outsource development. From requirements definition through traditional register transfer logic (RTL) or netlist hand-off, our team offers broad and flexible entry options and engagement models to access the technology. Our advanced, rad hard ASIC design flow incorporates the latest tools and features from leading EDA vendors, with a focus on physically knowledgeable synthesis, placement-based power optimization, clock-tree synthesis, and signal integrity.
Space-qualified packaging that works how you work
At BAE Systems, we understand the importance of packaging our rad hard Application Specific Integrated Circuits to fit in accordance with our customers’ systems and specifications. Our broad array of customized packaging solutions include single or multichip flip chip and wire bond attachment techniques in ceramic leadless chip carrier (CLCC), ceramic quad flat pack (CQFP), ceramic column grid array (CCGA), plastic ball grid array (PBGA), and other advanced packaging formats. We strive to assure the unconditional satisfaction of our space electronics customers.
DoD-certified quality, industry-trusted performance
Our radiation hardened ASIC products and services are provided by our Space Systems business in Manassas, Virginia, which is certified and qualified to Defense Logistics Agency (DLA) performance standards MIL-PRF-38535 and MIL-STD-883 for QML Class V and Q, including Radiation Hardness Assurance (RHA) and support for legacy requirements. This facility is a U.S. Department of Defense (DoD) Category 1A Microelectronics Trusted Source, as documented via their Trust program’s rigorous validation process, covering design, aggregation, broker, packaging/assembly, and test services.
Learn more. Visit our Radiation Hardened Electronics literature page, or contact one of our space products business representatives today.
Business Development