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Radiation-hardened application specific integrated circuits (ASICs)

45 nm ASIC

ASICs chip
BAE Systems' advanced radiation-hardened (rad-hard) ASIC technologies, libraries, and services provide a complete, state-of-the-art solution for the development of system-on-chip (SoC) products to address a myriad of space processing needs.

Electronic Systems offers:


  • Application Specific Design Services
  • Radiation-hardened, low-power, and high-reliability circuit libraries
  • Space-qualified packaging solutions
    • Flipchip
    • Wirebond
    • Ceramic quad flat pack
    • Ceramic column grid array
    • Plastic ball grid array


Learn more about application specific integrated circuits

Please consult our product catalog and datasheets via the product literature link at right or contact the representative of BAE Systems for more information.