
SpaceWire radiation-hardened single-chip interface performs the functions of multiple chips at a fraction of the size while saving cost, space, weight, and power. Developed through a partnership with NASA, SpaceWire interface chips will be used on the Geostationary Operational Environmental Satellite and Lunar Reconnaissance Orbiter missions.
By integrating multiple functions, this single-chip solution eliminates the need for an additional bus for command and control by enabling the reliable transport of SpaceWire high-speed serial links. The chip is radiation-hardened to 200 krad(Si) total dose, measures less than 1E-9 upsets/bit-day SEU, and is latchup-immune.
FEATURES
- Four SpaceWire ports and two peripheral component interconnect busses, connected by a six-port router.
- A multi-gigabyte memory interface supported by a direct-memory access controller.
- An embedded microcontroller usable for packet-processing or standalone operation.
Additionally, BAE Systems has created a SpaceWire evaluation board. The 6U 160 CompactPCI evaluation board represents a first generation SpaceWire solution. This cost-effective prototyping board uses the custom SpaceWire application-specific integrated circuit to implement a four-port SpaceWire card with onboard memory. It provides complete router capability among the four ports, along with two user-end-point ports.
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Radiation-hardened electronics

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Space Protection & Advanced Mission Payload

Radiation-hardened application specific integrated circuits (ASICs)
