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Encapsulation Process Service

Encapsulation Process Capability
We offer a range of encapsulation processes to meet the requirements of the Mission Systems manufacturing facility.

Key capabilities include::

  • Parylene deposition for coating of conventional PECs, microwave substrates, antenna assemblies and high voltage electronic assemblies
  • Vacuum impregnation using an autoclave for encapsulation of high voltage equipment
  • Spraying application of conventional conformal coating (varnishes etc.)
  • Encapsulation using all types of epoxy resins and adhesives
  • Vapour condensation re-flow capability, and Mass Spectrometer

View our datasheet for more information on our encapsulation process capabilities