Complementing our research and development services, the ATC incorporates a dedicated suite of secure facilities providing the ability to manufacture products from a one-off prototype through to low volume batch production. We specialise in supporting the transition of technology into product through activities including rapid prototyping, specialist and high precision machining and cleanroom fabrication.
From Micro and Nano-technology to radomes, microwave components through to rotating radar joints, our specialist manufacturing capabilities and facilities ensure the delivery of innovative new technologies into practical applications in the real world for aerospace, defence and commercial customers. We take pride in turning our customers engineering concepts into physical reality, producing products that perform to exacting standards in some of the most demanding environments on earth and in space.
Our facilities have been utilised extensively to support our customers in the development of products and capabilities such as corrosion and stress monitors, spiral and array antennas, tuned radomes and composites, rotating joints and security sensors – illustrating the exceptional variety of our skills and facilities. What links all these examples is our commitment to innovation, manufacturing excellence and the practical deployment of technology to support our customers’ business goals.
In an era when ‘smaller, lighter, faster, cheaper’ is a mantra for the development of electronic systems and components, we are expanding our capabilities by thinking big and building small.
Our ‘Open Access’ cleanroom manufacturing facilities provide our customers with the ability to develop new or improved materials or devices using Micro-Electro Mechanical Systems (MEMS) technologies and processes. Our world leading MEMS specialists deliver concept development, detailed design supported through simulation and modelling, on through to prototyping, device fabrication and evaluation. Our experience in transitioning prototype devices into pilot production or high volume foundry provides confidence in achieving long term business revenue streams from the implementation of MEMS solutions.
Our combination of knowledge, resources and experience allows us to deliver a comprehensive capability in the development and application of MEMS devices in technologies such as silicon, glass polymers, piezoceramics and other substrates with integrated analogue or digital electronics as appropriate.
The device scale capability of MEMS is complemented through our electronics packaging capability covering 2D, flexi-rigid and chip-on-chip implementation. Our unique CirCube™ service delivers substantial savings in size, weight and cost over traditional packaging techniques by moving into the third dimension and creating 3D integrated electronic cubes.
- Antenna manufacture
- Composite structures and radomes
- Delay lines
- MEMS packaging
- Micro manufacture
- Nano technology
- Precision assembly
- Precision CNC machining
- Reverse engineering and manufacture
- Space qualified microwave components
- Wiring assembly
