After microwave module design is complete, the module development facility is the first stop in the microwave module manufacturing development cycle. The facility is particularly strong in developing innovative assembly techniques and methods. Once developed, these techniques provide for enhanced process controls, while reflecting a modest decrease in touch labor costs.
The facility's engineering staff is involved in the development and manufacture of complex, high-performance microwave and millimeter-wave multifunction module assemblies, from program inception through the production development phase. The frequency range for these products is 1 to 26.5 GHz for broadband electronic warfare designs, and K, Ka, Q, V, and W bands for narrowband designs (typically for space-based applications).
The module development facility has developed an electronic materials traceability database application that allows for material lot traceability down to the reference designator level. This application provides for cost-effective material lot traceability for highly complex space-bound and military applications. In addition, process control documentation is captured electronically and related to the assembly.
The facility is capitalized and staffed for mid- to low-volume, highly complex microwave and millimeter-wave module deliveries, development, and feasibility. In addition to module assembly capabilities, the module development facility also specializes in monolithic microwave integrated circuit chip and microwave substrate segregation and packaging. Automatic, semiautomatic, and manual equipment is available for visual inspection, segregation, and specialty packaging of the thin, fragile microwave devices.
For more information, please contact:
Martin Priolo
Tel: +1 603 885 6928
martin.a.priolo@baesystems.com
