The module design group is involved in the development and manufacture of complex, high-performance microwave and millimeter-wave multifunction module assemblies.
The frequency range for these products is 1 to 26.5 GHz for broadband electronic warfare designs, and K, Ka, Q, V, and W bands for narrowband designs. Products include high-performance amplifiers (low-noise and power), down and up converters, and multifunction assemblies.
BAE Systems follows a rigorous methodology for each product design, from the initial concept through release to production. Typical analyses include electromagnetic, statistical, design-to-cost, thermal, reliability, and structural. BAE Systems has a dedicated mechanical analysis center and an environmental testing facility that supports all ship, airborne, land, and space environments.
Packaging technologies consist of mixed-signal mode, multilayer soft laminate, SMT designs, and chip and wire hybrid MIC assemblies (higher frequency and higher performance). All designs are built to the demanding requirements of Mil-PRF 38534. Spaced-based product and prototype units are fabricated in the module development facility. With an automated module fabrication capability, the operations group is available for higher-volume manufacturing.
The engineering staff works closely with the customer at the subsystem level to best leverage available technologies. This service, coupled with the in-house monolithic microwave integrated circuit design capability, makes the module design group vertically integrated.
For more information, please contact:
Martin Priolo
Tel: +1 603 485 7940
martin.a.priolo@baesystems.com
