The Module Design group is involved in the development and manufacture of complex high-performance microwave and milimeter-wave multi-function module assemblies. The frequency range for these products range from 1-26.5 GHz for broadband EW designs, and narrowband designs at K, Ka, Q, V, and W bands. The products are high-performance amplifiers (low-noise and power), down/up converters, and multifunction assemblies. In addition, the engineering staff works closely with the customer at the subsystem level to best leverage available technologies. This, coupled with the in-house MMIC design capability, makes us truly vertically integrated.
The company follows a rigorous methodology for each design from the initial concept through release to production. Typical analyses include electromagnetic, statistical, design-to-cost, thermal, reliability, and structural. BAE Systems has a dedicated mechanical analysis center and an environmental testing facility that supports all ship, airborne, land, and space environments.
Packaging technologies consist of mixed signal mode, multi-layer soft laminate, SMT designs, and chip and wire hybrid MIC assemblies (higher frequency and higher performance). All our designs are built to the demanding requirements of Mil-PRF 38534. Spaced-based product and prototype units are fabricated in our module development facility. With an automated module fabrication capability, our operations group is available for higher-volume manufacturing.
For further information please contact:
+1 603-485-7940
martin.a.priolo@baesystems.com
