BAE Systems' Microwave Test group supports a wide range of projects, from production to highly specialized testing of research and development devices, monolithic microwave integrated circuits (MMICs), and modules. The test group performs high-frequency testing of MMICs and modules for a diverse range of applications at frequencies from 1 to 200 GHz. Test capabilities include:
- Continuous S-parameter test coverage through 110 GHz, 140-220 GHz.
- Power, noise figure, and spectral testing (2OIP, 3OIP, etc.) at most frequencies of interest through 94 GHz.
- On-wafer testing up to six-inch wafer size, including autoprobers.
- One-touch test stands for on-wafer testing through 20 GHz. This allows S-parameter, power, noise, and spectral testing to be performed with a single touchdown of the test probes, minimizing probe-induced damage.
- Specialized device characterization capabilities, including noise parameter and load pull.
- On-wafer testing results in wafer maps, and yielding and binning of MMICs to customer specifications.
For more information, please contact:
Phillip Smith
Tel: +1 603 885 6785
phillip.m.smith@baesystems.com
