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PEC rapid response cell
In addition to reducing development timescales, it can demonstrate the savings identified through DfM.
Key Performance Features
- Cost and lead-time drivers highlighted at an early design stage.
- Focus on building customer relationships through a solutions oriented approach.
- Vast experience in the assembly of small footprint devices from BGAs with ball counts in excess of 1700, pitches down to 0.5mm, 0201 chips and 0301 resistors for microwave applications.
- X-Ray/optical inspection, closed loop rework for BGA and QFP replacement.
Contact
Jim Neilson – Rapid Response Cell Manager
jim.neilson@baesystems.com
+44 (0) 1383 836090
Facility Location
North Way,
Hillend Ind Park,
nr Dunfermline,
Fife,
KY11 9HQ
