Electronics and Packaging

The Advanced Technology Centre offers a one-stop-shop for the design and specialist manufacture of electronics and packaging, using our extensive fabrication and construction capabilities, supplemented with specialist skills from our network of partners through the supply chain.

Our expertise encompasses the range of disciplines that are required for successful miniaturisation of electronic systems covering efficient circuit and system design, appropriate levels of integration at the semiconductor (i.e. silicon, GaAs) level, the most appropriate electronic packaging technology for the application and advanced thermal management techniques. Our experience also encompasses the development, combination and application of a wide range of the latest electronic packaging techniques. These include Silicon-on-Silicon, System-in-a-Package,Chip-in/on-PCB, Thick/Thin Film Ceramic Hybrid,BGA,Chip-scale, Liquid Crystal Polymer, folded (2.5-D) and full 3-D.
Our solutions portfolio includes direct-write technology which uses special inks and pens to deposit tracks and components directly onto structures, eliminating the need for separate circuit boards and enclosures. Components cover highly compact and non-intrusive sensors where the connecting paths are simply 'drawn' onto the base structure, delivering potential solutions across a range of industries and applications.
The performance of components and sub-systems is increasingly dependent on their thermal performance. We are involved in developing and applying state-of-the-art thermal management technologies across a range of application areas to meet a variety of market drivers. We also have extensive experience in the diagnosis of thermal problems and devising innovative solutions.

We have a long tradition of developing unique solutions for low-power through to extreme high-power applications. Our focus areas include: power-conditioning including high frequency switch mode converters, energy storage and management – ultra-capacitors, fuel cells, batteries, ultra compact high-voltage high power capacitor charging converters. Our range of power system solutions also encompasses the latest technology for wireless power transfer and energy scavenging.

Building on our experience in process development, design and manufacture of bespoke components,we offer services in vendor selection, process and vendor audit, and diagnostic problem-solving for products in-service. This closes the life-cycle loop, providing valuable experience and knowledge of operator and product interaction, which often inspires a new cycle of product innovation.

• Direct Write
• Electronic packaging
• Miniaturisation
• Power supplies
• Specialist manufacturing
• Thermal management
• Vendor and process audit